Electrical Packaging Engineer

Our leading and innovative client is now searching for an Electrical Packaging Engineer to be responsible for driving the design and delivery of complex electrical packaging solutions for photonic and electronic modules. The role will require transferring new products from R&D into high volume production, ensuring that yield, performance, thermal and reliability requirements are all met. Working closely with manufacturing partners, both locally and overseas, to ensure manufacturability and cost efficiency will be an important part of the role. Required skills for the Electrical Packaging Engineer will include: Strong electrical packaging experience, including substrate and interposer design Experience with high bump-count, large-area chip packaging Knowledge of mechanical stress, warpage, thermal management, and yield improvement techniques Excellent communication skills Degree qualified Please contact Rachel Anderson for further details.

Location: Oxford, UK, GB

Posted Date: 10/26/2025